Lead Electromechanical Design and Analysis Engineer

Lead Electromechanical Design and Analysis Engineer Company: Boeing India
Private Limited Overview As a leading global aerospace company, Boeing develops,
manufactures and services commercial airplanes, defense products and space
systems for customers in more than 150 countries. As a top U.S. exporter, the
company leverages the talents of a global supplier base to advance economic
opportunity, sustainability and community impact. Boeing’s team is committed to
innovating for the future, leading with sustainability, and cultivating a
culture based on the company’s core values of safety, quality and integrity.
Technology for today and tomorrow The Boeing India Engineering & Technology
Center (BIETC) is a 5500+ engineering workforce that contributes to global
aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and
high-quality engineering work in global markets, and leverage new-age
technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive
Manufacturing, shaping the future of aerospace. People-driven culture At Boeing,
we believe creativity and innovation thrives when every employee is trusted,
empowered, and has the flexibility to choose, grow, learn, and explore. We offer
variable arrangements depending upon business and customer needs, and
professional pursuits that offer greater flexibility in the way our people work.
We also believe that collaboration, frequent team engagements, and face-to-face
meetings bring together different perspectives and thoughts – enabling every
voice to be heard and every perspective to be respected. No matter where or how
our teammates work, we are committed to positively shaping people’s careers and
being thoughtful about employee wellbeing. With us, you can create and
contribute to what matters most in your career, community, country, and world.
Join us in powering the progress of global aerospace. Job Description Summary
Resolves complex issues on critical programs related to architectural
approaches, requirements, specifications and design. Leads technical aspect of
proposal preparation. Identifies critical performance measures and develops
processes for computing them. Leads activities in support of Supplier Management
with make/buy recommendations and other technical services. Coordinates
engineering support throughout the lifecycle of the product. Develops new
concepts for future product designs to meet projected requirements. Recommends
and manages technology insertion. Works under consultative direction. Position
Overview The Boeing India Engineering and Technology Center (BIETC) is looking
for a Lead Electro Mechanical Packaging Design & Analysis Engineer, to drive the
design, development, integration, and qualification of electromechanical
products. This leadership role requires strong Electromechanical packaging
knowledge along with cross-disciplinary knowledge (production, electrical,
systems), hands-on design experience with 3D CAD and prototype development,
demonstrated leadership of engineering teams, and experience working on
qualification and global suppliers. Position Responsibilities: The successful
candidate will perform the following duties: As senior technical leader who
combines deep technical expertise, demonstrated systems-thinking, conflict
resolution skills, and proven people leadership to drive delivery and uplift
engineering practices Resolves complex issues on critical programs related to
architectural approaches, requirements, specifications and design. Lead the
design and development of electromechanical products in close coordination with
software, electronics, systems, manufacturing and certification authorities.
Leads technical aspect of proposal preparation. Identifies critical performance
measures and develops processes for computing them Develops new concepts for
future product designs to meet projected requirements. Recommends and manages
technology insertion Provide technical quality review of the development and
documentation of Mechanical, Structural and thermal environment to establish the
Electro Mechanical system design. Apply and enforce engineering practices,
develop mechanical architecture of the LRU, standards, principles and techniques
across the team. Plan, assign, and delegate project tasks and responsibilities
through all phases of the project lifecycle. Collaborate and communicate
effectively with cross-functional teams and stakeholders (systems, software,
electronics, manufacturing, supply chain, regulatory). Develop prototype
production equipment by designing, simulating, building, modifying, testing, and
integrating components to minimize risk and demonstrate concept feasibility.
Mentor and provide technical guidance to engineers during project execution.
Strong problem-solving skills to drive root-cause analysis for technical issues,
validate data accuracy, and implement corrective design changes. Leads project
reviews with Larger Program Teams through events such as PDR, CDR and TDR. This
position will be in Boeing India Engineering and Technology Center, Bangalore,
India. Basic Qualifications (Required Skills/Experience): Bachelor of Science
degree in Engineering with a focus in Mechanical or Aeronautical or non-US
equivalent qualifications directly related to the work statement. Skills and
ability to: collect, organize, synthesize, and analyze data; summarize findings;
develop conclusions and recommendations from appropriate data sources. Knowledge
of various engineering disciplines such as electrical, mechanical, and systems.
The ability to communicate with technical personnel from multiple skill areas
and functions to evaluate technical information and issues impacting design,
production, and support of products, services, or other deliverables. Knowledge
of manufacturing, methods, fabrication processes (e.g., forming, stamping,
machining, heat treatment, machines/machine tools, cutting tools and fluids, N/C
programming, instrumentation, data acquisition and control systems). Advanced
knowledge of design concepts and techniques (e.g., concurrent engineering,
Design for Manufacture/Assembly [DFM/A])/DFX. Ability to understand the big
picture and the inter-relationships of all positions and activities in the
system, including the impact of changes in one area on another area. This
includes the ability to see and understand the inter-relationships between
components of systems and plans, anticipate future events, and apply the
principles of systems thinking to accelerate performance. Experience in using
Engineering design tools, specifically, 3D CAD tools such as Creo/NX/Catia,
PLM(Teamcenter/Enovia/3DX) and good understanding of ASME Y14.5 Geometric
Dimensioning and Tolerance Standards. Has worked on multiple Electromechanical
project complete design, development and certification life cycles. Experience
in Aerospace Material Selection, Manufacturing processes and Finish. Able to
verify accuracy of technical and non-technical data. Gathers relevant data for
root cause analysis and produces changes to resolve the discrepancies in design
packages. Experience in supervising engineering achievements like on time
delivery, quality etc. Manages medium to large projects with minimal mentorship
from Program Group Experience in guiding technical teams towards scope and
resolving intra functional and inter functional conflicts for unified project
team goals. Experience in coordinating with supply chain/sourcing and regulatory
authorities for hardware development globally Typical Education & Experience:
Mechanical Engineering degree and 12+ years of related work experience, or a
Master's degree and 11+ years' of related work experience. Relocation: This
position offers relocation based on candidate eligibility. Language
Requirements: Not Applicable Education: Bachelor's Degree or Equivalent
Relocation: This position offers relocation based on candidate eligibility.
Security Clearance: This position does not require a Security Clearance. Visa
Sponsorship: Employer will not sponsor applicants for employment visa status.
Contingent Upon Award Program This position is not contingent upon program award
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